This year, iDICs will be partnering with The Society for Experimental Mechanics to facilitate a joint meeting. This conference will serve as both the iDICs 2016 Conference & Workshop as well as the SEM Fall Conference.
Abstract submission: Abstract deadline extended to Aug 5th, email a 250 word or less abstract to firstname.lastname@example.org
November 7-10, 2016, Philadelphia, PA, USA
The International Digital Image Correlation Society invites your participation in its annual conference and workshop in Philadelphia, PA. We welcome you to join this new society aimed at inspiring members to continually improve their application and development of image correlation methods.
Present a talk or simply come learn about the latest developments in the following DIC fields:
- Ultra-high speed DIC
- Uncertainty quantification
- Novel applications of DIC
- Volumetric DIC
- Educational uses for DIC
- DIC standardization
- Global methods
- Adaptive DIC
- Biomaterial applications
- Civil and mechanical engineering applications
- DIC best practices
- Algorithms/computational methods
- Outdoor/large scale testing
Founders Award Lecture – Brian Bay
Associate Professor, School of Mechanical, Industrial & Manufacturing Engineering, Oregon State University
The Nexus of Digital Image Correlation, Digital Volume Correlation, and Finite Element Analysis
Digital Image Correlation (DIC) is firmly established in the experimental sciences world, but as suggested by the iDICs mission themes of “Extend – Train – Standardize – Improve”, challenges remain. In this presentation I will share experiences with managing DIC projects in the university laboratory classroom, and in developing Digital Volume Correlation (DVC) techniques through academic research. These endeavors have led to a conclusion: despite the remarkable progress made toward improvements in the details of DIC and DVC technique, what is needed now is an integrative view that considers the broad context of in situ experimental methodology and project goals. I will also argue that a useful guide for successful DIC and DVC, particularly in challenging applications, is Finite Element Analysis (FEA). Beyond the formal links that have been explored between DIC/DVC and FEA, the broad conceptual and organizational aspects of this analytical methodology provide a very useful guide for conducting image-based experimentation.
Plenary Lecture – Arun Shukla
Simon Ostrach Professor, Department of Mechanical, Industrial and Systems Engineering, University of Rhode Island
Recent Experimental Studies on Structural Response under Extreme Loading Conditions
Experimental mechanics applications under extreme loading conditions pose several challenges. These challenges are even more pronounced when structures/materials are subjected to more than one extreme loading. This lecture will present two recent studies on the response of engineering materials and structures to extreme dynamic loadings in the presence of high temperatures and high pressures, respectively. In particular, the talk will focus on the response of pre-loaded structural elements to combined shock and high temperature loadings and underwater implosion response of cylindrical shells subjected to explosive loadings. Experiments were conducted to study the mechanics of implosion of cylindrical tubes occurring within a closed tube and open field environment. The pressure histories generated by the implosion event were captured from dynamic pressure transducers in all the experiments. These pressure histories were related to real time deformation occurring on the shells. High speed images were also captured for better understanding the deformation mechanisms and collapse modes of the specimens during the experiments. The use of 3D digital image correlation technique (3D-DIC) technique for underwater applications was clearly demonstrated for these underwater experiments. In a second series of experiments the shock response of pre-loaded plate’s fabricated using super-alloy (Hastelloy X) was studied at room and at elevated temperatures. A 3D-DIC was used in conjunction with a band pass optical filter and high intensity light source to record images under shock loading at high temperatures up to 900°C.
Plenary Lecture – Paul Moy
US Army Research Laboratory
Advanced Digital Image Correlation Techniques at the Army Research Laboratory: Past, Present, and Future
For the past 10 years, ARL has been extensively using digital image correlation (DIC) techniques across a range of experimental research programs. One of the earliest applications of DIC was for the demonstrator composite rail gun project. Although there were some limitations, this effort still proved invaluable as full-field displacements and strains were acquired, during live electrical capacitor discharges up to 800 kV, that were near impossible to obtain with traditional methods due to the high magnetic field in the surrounding area. Results presented insights on the transient surface strains of the carbon fiber overwrap. In the years that followed, ARL gradually begin to adopt DIC methods for experiments such as impact studies at ballistic ranges and laboratory scale, biological materials, DIC in lieu of strain gages when called for in ASTM, and micron-length (10’s to 100’s) scale measurements to name a few. One of challenges at the small length scale is the ability to produce the typical random speckle pattern necessary to achieve efficacious DIC results. Near in-situ microscopy imaging of single fiber tensile experiments was demonstrated. In this case, the inherent surface features of UHMWPE single fibers provided sufficient patterns to correlate from laser confocal microscope images. More recently, under a successful completion of a SBIR Phase II program, an ultra-high speed (up to 5M fps) stereo DIC system was developed that offers both temporal and spatial resolution to meet the needs to observe fracture initiation and propagation in brittle materials such as ceramic armor. With the addition of several newly acquired computed tomography (CT) systems, current and future endeavors will explore volumetric digital image correlation that will include unique in-situ loading stages. This will open many realms of possibilities to obtain in-depth understanding of material structures in relationship with their mechanical responses. This will highly enhance many of ARL’s materials research areas; open and closed cell foams, additive manufacturing, laminated composites, ceramics, and biological materials.
Practical Considerations for Quantitative DIC Measurements, Instructor: Pascal Lava (MatchID)
How to Pattern Everything, Instructor: Tim Schmidt (Trillion/GOM)
Uncertainty Quantification/Standardization for DIC, Instructors: Phil Reu (Sandia) and Mark Iadicola (NIST)
Early registration (before Sept 1): $695
Late Registration (on or after Sept 1): $845
Student early registration (before Sept 1, identification required): $450. A $200 student registration sponsorship is available, email email@example.com for more information.
Student late registration (on or after Sept 1): $500
Full day course registration for registered iDICs conference attendees: $350
Half day course registration for registered iDICs conference attendees: $175, per course
Full day course registration for non-iDICs conference attendees: $500
Half day course registration for non-iDICs conference attendees: $250, per course
All fees are non-refundable.
Check this site frequently for information updates. More information will be posted here when available.
Conference Coordinator: Kathy Loeppky, firstname.lastname@example.org, (505) 844-2376
DoubleTree by Hilton
To get the conference discount, hotel reservations must be made via this link: Hotel Reservations
Philadelphia Center City
237 South Broad Street, Philadelphia, PA
Call for Session Organizers
The iDICs Board of Directors is looking for session organizers and field leaders interested in participating in committees. Read the session organizer call to find out how you can participate in organizing tracks at iDICs 2016.
The session organizer call can be downloaded here.
Extended Abstract Submission
In addition to the short abstract (up to 250 words), an extended abstract (between 2 and 3 pages) must be submitted via the link below before August 15th.
The call can be found here
USA Visa invitation letters for foreign participants: email email@example.com to request a letter of invitation.
February 12, 2016 Tracks and session organizers identified
End February, 2016 Official call for abstracts distributed and submission process enabled
August 5, 2016 Due date for short, 250 word abstract submissions (12:00 midnight), email it to firstname.lastname@example.org
August 15, 2016 Abstract acceptance review process completion and author notification
September 1, 2016 2 page extended abstract due
September 1, 2016 End of early registration
October 7, 2016, Last day to book hotel room at the group rate